Chemical Mechanical Polishing (CMP) F-REX200M2

EBARA's CMP system Model F-REX is Chemical Mechanical Polishing system that enables nanometer
level planarity (10~20nm on 300mm wafer) in semiconductor manufacturing process.
Ebara's latest CMP system, Model F-REX200M2 and F-REX300X has achieved both an advanced
process performance and high productivity. This is made possible with "1-head per 1-table" unique
architecture processing an individual wafer delicately while the "4 table platform" enables high
throughput.
Advantages:
 Dry-In/Dry-out
 High Process Performance
 Improved Productivity, high reliability and ease of maintenance
 Multi Step Chemical Cleaning Capability
 3 Step Chemical Clean Capability
 Process End Point Monitor (Option)
 In-line Thickness Monitor (Option)
 Customer Specific Options
 High Volume Production Capability
 Slurry Supply Unit
 Slurry Controlled Supply System
 Wastewater Treatment System utilizing the zero emission conceptions
 SECS/GEM, HSMS communication