Bevel Polishing System

EBARA's Model EAC is a bevel polishing system to remove defects from edge and/or surrounding
area of semiconductor wafer, including backside.
Ebara’s bevel polishing technology also extends to Through Silicon Via (TSV) application or other
wafer thinning application for bevel/edge treatment.
Advantages:
 Robust Polish/Removal Capability using Fixed Abrasive
 Contact free concept to Device surface during process
 Non Selective Bevel Surface Cleaning
 Knife Edge Elimination
 Selective Backside Treatment