Wafer Plating System

EBARA's Model UFP is an electric plating system suitable for packaging application such as bumping
and Re-Distribution Layer (RDL). It is also used for Through Silicon Via (TSV) application for its
superior process performance.
Model UFP has been well accepted in manufacturing for superior within wafer non-uniformity,
defect free, low overburden process performance and high throughput enabled by its unique vertical
type plating cell technology.
Application:
 Gold bump - (cyanogen solution, non-cyanogen solution)
 Solder bump (eutectic solder, high melting point solder,
Low alpha ray solder, Pb free solder)
 Copper bump (copper sulfate)
Features:
 Superior uniformity on the plating wafer surface
 Automated cassette to cassette handling (Dry in/Dry out)
 Utilization of a wafer holder eliminates plating on the back and edge of wafers
 Plating defects resulting from air bubbles are reduced
 Peripheral systems:
Supply and quality control of plating solution.
Detoxification of lead and cyanogen compounds
Wastewater recycling (closed system)